[PATCH v3 0/3] usb: chipidea: msm: Clean and fix glue layer driver
From: Ivan T. Ivanov
Date: Tue Apr 22 2014 - 05:44:29 EST
From: "Ivan T. Ivanov" <iivanov@xxxxxxxxxx>
This series intend to fix driver, which was broken for a while.
It is used to create peripheral role device, which in coordination
with phy-usb-msm driver could provide USB2.0 gadget support for
Qualcomm targets.
Changes since version 2.
- Rename devicetree description file to ci-hdrc-qcom.txt to be in-line
with Freescale and Zevio naming scheme
- Use better name for usb-phy phandle.
- Make of_device_id structure const
[1] https://lkml.org/lkml/2014/2/18/209
Ivan T. Ivanov (3):
usb: chipidea: msm: Add device tree binding information
usb: chipidea: msm: Add device tree support
usb: chipidea: msm: Initialize offset of the capability registers
.../devicetree/bindings/usb/ci-hdrc-qcom.txt | 17 +++++++++++++++
drivers/usb/chipidea/ci_hdrc_msm.c | 24 +++++++++++++++++++++-
2 files changed, 40 insertions(+), 1 deletion(-)
create mode 100644 Documentation/devicetree/bindings/usb/ci-hdrc-qcom.txt
--
1.8.3.2
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