Re: [PATCH 0/3] Thermal extensions for flexibility in cooling device bindings

[Daniel Lezcano]

Hi Lukasz,

On 16/12/2019 15:06, lukasz.luba@xxxxxxx wrote:
> From: Lukasz Luba <lukasz.luba@xxxxxxx>
> 
> Hi all,
> 
> This patch set adds extensions to existing thermal zones and cooling devices
> binding. Currently they are pinned using static definitions e.g. DT cooling
> maps. These changes enable userspace like trusted middleware to change the
> layout of cooling maps unbinding and binding the cooling devices.
> It might be helpful for drivers loaded as a modules. They can be added to
> existing thermal zones to take part of the power split.
> It is based on the current work in thermal branch thermal/linux-next
> https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next

I've been keeping this series out of the previous merge because it did
not raise any comments and we are touching the sysfs.

For this release, I still don't know what to do with it.

Anyone a comment on this series? Rui ?

> Lukasz Luba (3):
>   docs: thermal: Add bind, unbind information together with trip point
>   thermal: Make cooling device trip point writable from sysfs
>   thermal: Add sysfs binding for cooling device and thermal zone
> 
>  .../driver-api/thermal/sysfs-api.rst          | 30 +++++++-
>  drivers/thermal/thermal_core.c                |  3 +-
>  drivers/thermal/thermal_core.h                |  2 +
>  drivers/thermal/thermal_sysfs.c               | 77 +++++++++++++++++++
>  4 files changed, 109 insertions(+), 3 deletions(-)
> 


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