Re: [PATCH 0/3] Thermal extensions for flexibility in cooling device bindings

[Lukasz Luba]

Hi Daniel,

On 3/13/20 1:33 PM, Daniel Lezcano wrote:
> Hi Lukasz,
>
> On 16/12/2019 15:06, lukasz.luba@xxxxxxx wrote:
> > From: Lukasz Luba <lukasz.luba@xxxxxxx>
> >
> > Hi all,
> >
> > This patch set adds extensions to existing thermal zones and cooling devices
> > binding. Currently they are pinned using static definitions e.g. DT cooling
> > maps. These changes enable userspace like trusted middleware to change the
> > layout of cooling maps unbinding and binding the cooling devices.
> > It might be helpful for drivers loaded as a modules. They can be added to
> > existing thermal zones to take part of the power split.
> > It is based on the current work in thermal branch thermal/linux-next
> > https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next
>
> I've been keeping this series out of the previous merge because it did
> not raise any comments and we are touching the sysfs.
>
> For this release, I still don't know what to do with it.

Thank you for bringing this back.

> Anyone a comment on this series? Rui ?

Regards,
Lukasz