Re: [PATCH v6 1/4] dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation

[J, KEERTHY]

On 5/9/2022 12:12 PM, Krzysztof Kozlowski wrote:
> On 09/05/2022 05:18, J, KEERTHY wrote:
> > On 4/27/2022 12:16 PM, Keerthy wrote:
> > > Add VTM bindings documentation. In the Voltage Thermal
> > > Management Module(VTM), K3 J72XX supplies a voltage
> > > reference and a temperature sensor feature that are gathered in the band
> > > gap voltage and temperature sensor (VBGAPTS) module. The band
> > > gap provides current and voltage reference for its internal
> > > circuits and other analog IP blocks. The analog-to-digital
> > > converter (ADC) produces an output value that is proportional
> > > to the silicon temperature.
> >
> > Hi krzysztof,
> >
> > Any comments on this version?
>
> You got Rob's review, so you don't need also mine.
>
> If you want, then in general look okay, except the description for "reg"
> you could split per items:
>
> reg:
>    items:
>      - description: VTM cfg1 register space
>      - description: VTM cfg2 register space
>      - description: efuse register space
>
> It's more obvious what items you expect.

Hi Krzysztof,

DTEX 
Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts
Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.yaml: found 
duplicate key "description" with value "VTM cfg2 register space" 
(original value: "VTM cfg1 register space")
Documentation/devicetree/bindings/Makefile:26: recipe for target 
'Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts' 
failed
make[1]: *** 
[Documentation/devicetree/bindings/thermal/ti,j72xx-thermal.example.dts] Er

I believe multiple instances of description is failing. So can i keep 
the description as is?

- Keerthy

> Best regards,
> Krzysztof