Re: [PATCH v2 00/17] thermal: Rework binding cooling devices to trip points

[Rafael J. Wysocki]

Hi Everyone,

On Mon, Aug 12, 2024 at 4:01 PM Rafael J. Wysocki <rjw@xxxxxxxxxxxxx> wrote:
>
> This is an update of
>
> https://lore.kernel.org/linux-pm/3134863.CbtlEUcBR6@xxxxxxxxxxxxx/#r
>
> the cover letter of which was sent separately by mistake:
>
> https://lore.kernel.org/linux-pm/CAJZ5v0jo5vh2uD5t4GqBnN0qukMBG_ty33PB=NiEqigqxzBcsw@xxxxxxxxxxxxxx/
>
> It addresses several (arguably minor) issues that have been reported by
> robots or found by inspection in the v1 and takes review feedback into
> account.
>
> The first 10 patches in the series are not expected to be controversial,
> even though patch [05/17] requires some extra testing and review (if it
> turns out to be problematic, it can be deferred without too much hassle).
>
> The other 7 patches are driver changes and code simplifications on top of
> them which may require some more time to process.  For this reason, I'm
> considering handling the first 10 patches somewhat faster, with the possible
> exception of patch [05/17].

Since patch [04/17] in this series turned out to be broken, I decided
to drop it and rearrange the rest.  This mostly affects patch [05/17]
and patch [17/17] which is the only one that really depends on the
former.

Of course, patch [05/17] also clashes with the Bang-bang governor
changes that have just been posted:

https://lore.kernel.org/linux-pm/1903691.tdWV9SEqCh@xxxxxxxxxxxxx/

For this reason, please skip patches [04/17] (broken), [05/17] (needs
to be rebased), and [17/17] (likewise) for now and focus on the rest
of the series which still is applicable (a couple of patches need to
be rebased slightly).

I'll send a rearranged v3 next week (I'll be mostly offline for the
rest of this week), most likely without the patches mentioned above
(I'll get back to them later).

Thanks!