Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

[Dmitry Baryshkov]

On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote:
> The cooling subnode of a remoteproc represents a client of the Thermal
> Mitigation Device QMI service running on it. Each subnode of the cooling
> node represents a single control exposed by the service.
> 
> Signed-off-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> ---
>  .../bindings/remoteproc/qcom,pas-common.yaml  |  6 ++
>  .../bindings/thermal/qcom,qmi-cooling.yaml    | 72 +++++++++++++++++++
>  2 files changed, 78 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> 
> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> index 68c17bf18987..6a736161d5ae 100644
> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> @@ -80,6 +80,12 @@ properties:
>        and devices related to the ADSP.
>      unevaluatedProperties: false
>  
> +  cooling:
> +    $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
> +    description:
> +      Cooling subnode which represents the cooling devices exposed by the Modem.
> +    unevaluatedProperties: false
> +
>  required:
>    - clocks
>    - clock-names
> diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> new file mode 100644
> index 000000000000..0dd3bd84c176
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> @@ -0,0 +1,72 @@
> +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
> +
> +%YAML 1.2
> +---
> +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
> +$schema: http://devicetree.org/meta-schemas/core.yaml#
> +
> +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices
> +
> +maintainers:
> +  - Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> +
> +description:
> +  Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
> +  across multiple remote subsystems. These devices operate based on junction
> +  temperature sensors (TSENS) associated with thermal zones for each subsystem.
> +
> +properties:
> +  compatible:
> +    enum:
> +      - qcom,qmi-cooling-cdsp
> +      - qcom,qmi-cooling-cdsp1

If I read your schema as you've it written, then ADSP, SLPI and modem
also can have _CDSP_ cooling device. Seems like an overkill.

Please take care to describe cooling devices for all DSPs at once and
describe them properly.


-- 
With best wishes
Dmitry