Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

[Gaurav Kohli]

On 1/29/2026 6:15 AM, Dmitry Baryshkov wrote:
> On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote:
> > The cooling subnode of a remoteproc represents a client of the Thermal
> > Mitigation Device QMI service running on it. Each subnode of the cooling
> > node represents a single control exposed by the service.
> >
> > Signed-off-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> > ---
> >   .../bindings/remoteproc/qcom,pas-common.yaml  |  6 ++
> >   .../bindings/thermal/qcom,qmi-cooling.yaml    | 72 +++++++++++++++++++
> >   2 files changed, 78 insertions(+)
> >   create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> >
> > diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > index 68c17bf18987..6a736161d5ae 100644
> > --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > @@ -80,6 +80,12 @@ properties:
> >         and devices related to the ADSP.
> >       unevaluatedProperties: false
> >   
> > +  cooling:
> > +    $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
> > +    description:
> > +      Cooling subnode which represents the cooling devices exposed by the Modem.
> > +    unevaluatedProperties: false
> > +
> >   required:
> >     - clocks
> >     - clock-names
> > diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> > new file mode 100644
> > index 000000000000..0dd3bd84c176
> > --- /dev/null
> > +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> > @@ -0,0 +1,72 @@
> > +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
> > +
> > +%YAML 1.2
> > +---
> > +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
> > +$schema: http://devicetree.org/meta-schemas/core.yaml#
> > +
> > +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices
> > +
> > +maintainers:
> > +  - Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> > +
> > +description:
> > +  Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
> > +  across multiple remote subsystems. These devices operate based on junction
> > +  temperature sensors (TSENS) associated with thermal zones for each subsystem.
> > +
> > +properties:
> > +  compatible:
> > +    enum:
> > +      - qcom,qmi-cooling-cdsp
> > +      - qcom,qmi-cooling-cdsp1
> If I read your schema as you've it written, then ADSP, SLPI and modem
> also can have _CDSP_ cooling device. Seems like an overkill.
>
> Please take care to describe cooling devices for all DSPs at once and
> describe them properly.

Thanks for review.

All the target supported in this series are limited to CDSP, so i will 
update the binding to describe

only the CDSP.