Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

[Gaurav Kohli]

On 1/28/2026 4:57 PM, Krzysztof Kozlowski wrote:
> On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote:
> > The cooling subnode of a remoteproc represents a client of the Thermal
> > Mitigation Device QMI service running on it. Each subnode of the cooling
> > node represents a single control exposed by the service.
> >
> > Signed-off-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> > ---
> >   .../bindings/remoteproc/qcom,pas-common.yaml  |  6 ++
> >   .../bindings/thermal/qcom,qmi-cooling.yaml    | 72 +++++++++++++++++++
> >   2 files changed, 78 insertions(+)
> >   create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> >
> > diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > index 68c17bf18987..6a736161d5ae 100644
> > --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > @@ -80,6 +80,12 @@ properties:
> >         and devices related to the ADSP.
> >       unevaluatedProperties: false
> >   
> > +  cooling:
> > +    $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
> > +    description:
> > +      Cooling subnode which represents the cooling devices exposed by the Modem.
> I do not see the reason why you need 3 (!!!) children here. Everything
> should be folded here.


Thanks Krzysztof for review.

Each subsystem may support multiple thermal mitigation devices through 
remote TMD service.

Because of this multiplicity, introduced separate binding file.

> > +    unevaluatedProperties: false
> > +
> >   required:
> >     - clocks
> >     - clock-names
> > diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> > new file mode 100644
> > index 000000000000..0dd3bd84c176
> > --- /dev/null
> > +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> > @@ -0,0 +1,72 @@
> > +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
> > +
> > +%YAML 1.2
> > +---
> > +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
> > +$schema: http://devicetree.org/meta-schemas/core.yaml#
> > +
> > +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices
> > +
> > +maintainers:
> > +  - Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> > +
> > +description:
> > +  Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
> > +  across multiple remote subsystems. These devices operate based on junction
> > +  temperature sensors (TSENS) associated with thermal zones for each subsystem.
> > +
> > +properties:
> > +  compatible:
> > +    enum:
> > +      - qcom,qmi-cooling-cdsp
> > +      - qcom,qmi-cooling-cdsp1
> What are the differences between them?


Some SOcs support multiple CDSP/NSP instances. Each instance requires 
it's own

compatible string to distinguish.


> Why these are not SoC specific?


They are not soc specific because the qmi thermal mitigation interface 
exposed by CDSP is architecturally

identical across multiple SOCS.


> > +
> > +patternProperties:
> > +  "cdsp-tmd[0-9]*$":
> > +    type: object
> No, you do not need childnode. See writing bindings (covers exactly this
> case).


Each subsystem may support multiple thermal mitigation devices through 
remote TMD service. So

need childnode to distinguish for different mitigations.

> > +
> > +    description:
> > +      Each subnode which represents qmi communication to CDSP.
> > +
> > +    properties:
> > +      label:
> > +        maxItems: 1
> > +
> > +      "#cooling-cells":
> > +        $ref: /schemas/thermal/thermal-cooling-devices.yaml#/properties/#cooling-cells
> > +
> > +    required:
> > +      - label
> > +      - "#cooling-cells"
> > +
> > +    additionalProperties: false
> > +
> > +required:
> > +  - compatible
> > +
> > +additionalProperties: false
> > +
> > +examples:
> > +  - |
> > +    remoteproc-cdsp {
> > +        cooling {
> > +            compatible = "qcom,qmi-cooling-cdsp";
> > +
> > +            cdsp_tmd0: cdsp-tmd0 {
> > +              label = "cdsp_sw";
> > +              #cooling-cells = <2>;
> > +            };
> > +        };
> > +    };
> > +
> > +  - |
> > +    remoteproc-cdsp1 {
> No, don't create unnecessary examples. Please read some slides from
> earlier talks so you won't need 10 iterations.


Sure, will update this.


> Best regards,
> Krzysztof