Re: [PATCH 3/3] usb: dwc3: introduce flatten model driver of i.MX Soc

[Thinh Nguyen]

On Mon, Feb 02, 2026, Frank Li wrote:
> On Mon, Feb 02, 2026 at 06:27:47PM +0800, Xu Yang wrote:
> > To support flatten dwc3 devicetree model, introduce a new driver.
> >
> > Signed-off-by: Xu Yang <xu.yang_2@xxxxxxx>

Can you include additional info to describe why this was needed
(written in your cover letter).

Also note any new feature supported by this glue that's not currently
available in the old driver.

Thanks,
Thinh

(ps. I'm thinking of creating a legacy_glues directory to start moving
all the legacy glue drivers there)