Re: [PATCH 3/3] usb: dwc3: introduce flatten model driver of i.MX Soc

[Xu Yang]

On Tue, Feb 03, 2026 at 12:44:57AM +0000, Thinh Nguyen wrote:
> On Mon, Feb 02, 2026, Frank Li wrote:
> > On Mon, Feb 02, 2026 at 06:27:47PM +0800, Xu Yang wrote:
> > > To support flatten dwc3 devicetree model, introduce a new driver.
> > >
> > > Signed-off-by: Xu Yang <xu.yang_2@xxxxxxx>
> 
> Can you include additional info to describe why this was needed
> (written in your cover letter).

Sure.

> 
> Also note any new feature supported by this glue that's not currently
> available in the old driver.

OK. No new feature in this driver.

> 
> Thanks,
> Thinh
> 
> (ps. I'm thinking of creating a legacy_glues directory to start moving
> all the legacy glue drivers there)

Got it. Thanks for sharing the info.

Thanks,
Xu Yang