Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

[Dmitry Baryshkov]

On Tue, Feb 24, 2026 at 05:39:42PM +0530, Gaurav Kohli wrote:
> 
> 
> On 2/20/2026 1:14 PM, Krzysztof Kozlowski wrote:
> > On 20/02/2026 08:29, Gaurav Kohli wrote:
> > > 
> > > 
> > > On 2/11/2026 1:43 PM, Krzysztof Kozlowski wrote:
> > > > On 11/02/2026 08:37, Gaurav Kohli wrote:
> > > > > 
> > > > > 
> > > > > On 2/8/2026 3:36 PM, Krzysztof Kozlowski wrote:
> > > > > > On 29/01/2026 13:06, Gaurav Kohli wrote:
> > > > > > > 
> > > > > > > On 1/28/2026 4:57 PM, Krzysztof Kozlowski wrote:
> > > > > > > > On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote:
> > > > > > > > > The cooling subnode of a remoteproc represents a client of the Thermal
> > > > > > > > > Mitigation Device QMI service running on it. Each subnode of the cooling
> > > > > > > > > node represents a single control exposed by the service.
> > > > > > > > > 
> > > > > > > > > Signed-off-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> > > > > > > > > ---
> > > > > > > > >      .../bindings/remoteproc/qcom,pas-common.yaml  |  6 ++
> > > > > > > > >      .../bindings/thermal/qcom,qmi-cooling.yaml    | 72 +++++++++++++++++++
> > > > > > > > >      2 files changed, 78 insertions(+)
> > > > > > > > >      create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> > > > > > > > > 
> > > > > > > > > diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > > > > > > > > index 68c17bf18987..6a736161d5ae 100644
> > > > > > > > > --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > > > > > > > > +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > > > > > > > > @@ -80,6 +80,12 @@ properties:
> > > > > > > > >            and devices related to the ADSP.
> > > > > > > > >          unevaluatedProperties: false
> > > > > > > > > +  cooling:
> > > > > > > > > +    $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
> > > > > > > > > +    description:
> > > > > > > > > +      Cooling subnode which represents the cooling devices exposed by the Modem.
> > > > > > > > I do not see the reason why you need 3 (!!!) children here. Everything
> > > > > > > > should be folded here.
> > > > > > > 
> > > > > > > 
> > > > > > > Thanks Krzysztof for review.
> > > > > > > 
> > > > > > > Each subsystem may support multiple thermal mitigation devices through
> > > > > > > remote TMD service.
> > > > > > > 
> > > > > > > Because of this multiplicity, introduced separate binding file.
> > > > > > 
> > > > > > This explains nothing. Subsystem does not matter for the binding. My
> > > > > > comment stays.
> > > > > > 
> > > > > 
> > > > > thanks for this suggestion, we will use qcom,pas-common.yaml to define
> > > > > bindings and avoid creating new file.
> > > > 
> > > > I asked not to create any children nodes.
> > > > 
> > > 
> > > We have multiple cores within a subsystem(cdsp) and each core has its
> > > own independent DCVS. And also we have dedicated TSENS sensor placed on
> > > each core within the subsystem.
> > 
> > Your own example in this patch had only one device, so how do you
> > imagine to convince us with incomplete or half baked code?
> > 
> 
> Target of this series supports one tmd per remoteproc, due to which we have
> not posted examples of multiple tmd. Can i use dt binding example sections
> to describe all tmd's per remoteproc?

I think you have spent more time arguing that you this series is limited
to CDSP than would have been spent on adding ADSP/ SLPI / MDSP support.

> 
> > > As a result, each core requires its own cooling device, which must be
> > > linked to its TSENS thermal zone. Because of this, we introduced
> > > multiple child nodes—one for each cooling device.
> > 
> > So you have one device with cooling cells=1+2, no?
> > 
> 
> This will be a bigger framework change which is not supported, i can see
> other drivers are also using something like this multiple cooling device
> under device node, below are few examples :
> 
> ->Documentation/devicetree/bindings/hwmon/microchip,emc2305.yaml
>   In this multiple fan child nodes are present.
> 
> -> Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.yaml
>   In this multiple child nodes are present, like heavy and light.
> 
> Please suggest if our current approach is fine or you want us to implement
> in some other way.
> 
> > > 
> > Best regards,
> > Krzysztof
> 

-- 
With best wishes
Dmitry