Re: [PATCH 0/4] thermal/core: Decouple release paths for tz and cdev

[Daniel Lezcano]

Hi Rafael,

On 5/8/26 20:10, Daniel Lezcano wrote:
> On 5/8/26 20:05, Daniel Lezcano wrote:
> > This series cleans up the lifetime handling of thermal devices.
> >
> > Currently, the thermal class release callback handles both thermal
> > zones and cooling devices by checking the device name prefix. This
> > approach is fragile and mixes responsibilities across different object
> > types.
> >
> > The first two patches introduce dedicated struct device release
> > callbacks for thermal zones and cooling devices. This removes the need
> > to rely on device names and keeps the lifetime management local to
> > each object.
> >
> > The last two patches convert the thermal class to a dynamically
> > allocated object and simplify the initialization logic by using the
> > class pointer itself as a guard instead of a separate boolean flag.
> >
> > Overall, this results in a clearer separation of responsibilities and
> > more robust lifetime management aligned with the device model.
> >
> > No functional change intended.
> Unless I’m mistaken, the patch sent to split the cooling device 
> registration is correct with this cleanup.

Were you able to apply the patch splitting the cooling device 
registration on top of this series ?