Re: [PATCH 0/4] thermal/core: Decouple release paths for tz and cdev

[Rafael J. Wysocki]

On Wed, May 13, 2026 at 4:22 PM Daniel Lezcano
<daniel.lezcano@xxxxxxxxxxxxxxxx> wrote:
>
>
> Hi Rafael,
>
> On 5/8/26 20:10, Daniel Lezcano wrote:
> > On 5/8/26 20:05, Daniel Lezcano wrote:
> >> This series cleans up the lifetime handling of thermal devices.
> >>
> >> Currently, the thermal class release callback handles both thermal
> >> zones and cooling devices by checking the device name prefix. This
> >> approach is fragile and mixes responsibilities across different object
> >> types.
> >>
> >> The first two patches introduce dedicated struct device release
> >> callbacks for thermal zones and cooling devices. This removes the need
> >> to rely on device names and keeps the lifetime management local to
> >> each object.
> >>
> >> The last two patches convert the thermal class to a dynamically
> >> allocated object and simplify the initialization logic by using the
> >> class pointer itself as a guard instead of a separate boolean flag.
> >>
> >> Overall, this results in a clearer separation of responsibilities and
> >> more robust lifetime management aligned with the device model.
> >>
> >> No functional change intended.
> > Unless I’m mistaken, the patch sent to split the cooling device
> > registration is correct with this cleanup.
>
> Were you able to apply the patch splitting the cooling device
> registration on top of this series ?

I haven't tried that yet, but I'll do it later today.