Re: [PATCH v3 2/8] soc: qcom: Add support for QMI TMD cooling devices

[Daniel Lezcano]

On 6/9/26 13:30, Dmitry Baryshkov wrote:
> On Tue, Jun 09, 2026 at 03:52:57PM +0530, Gaurav Kohli wrote:
> > From: Casey Connolly <casey.connolly@xxxxxxxxxx>
> >
> > Add a Qualcomm QMI Thermal Mitigation Device (TMD) to support thermal
> > cooling devices backed by remote subsystems.
> >
> > On several Qualcomm platforms, remote processors (for example modem and
> > CDSP) expose thermal mitigation controls through the TMD QMI service.
> > Client drivers need a way to discover that service, map DT thermal
> > mitigation endpoints to cooling devices, and forward cooling state
> > updates to the remote subsystem.
> >
> > Co-developed-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> > Signed-off-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> > Signed-off-by: Casey Connolly <casey.connolly@xxxxxxxxxx>
> > Signed-off-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxxxxxxxx>
>
> Wrong SoB chain.

I think Gaurav wanted to reflect the changes did a back and forth 
between us, so I ended up in the delivery path somehow. I guess adding 
Co-developped-by should fix the SoB but won't reflect Gaurav and Casey 
did actually most of the work. So I'm fine if we remove my SoB to fix 
the chain