Re: [PATCH v3 2/8] soc: qcom: Add support for QMI TMD cooling devices

[Dmitry Baryshkov]

On Tue, Jun 09, 2026 at 02:08:57PM +0200, Daniel Lezcano wrote:
> On 6/9/26 13:30, Dmitry Baryshkov wrote:
> > On Tue, Jun 09, 2026 at 03:52:57PM +0530, Gaurav Kohli wrote:
> > > From: Casey Connolly <casey.connolly@xxxxxxxxxx>
> > > 
> > > Add a Qualcomm QMI Thermal Mitigation Device (TMD) to support thermal
> > > cooling devices backed by remote subsystems.
> > > 
> > > On several Qualcomm platforms, remote processors (for example modem and
> > > CDSP) expose thermal mitigation controls through the TMD QMI service.
> > > Client drivers need a way to discover that service, map DT thermal
> > > mitigation endpoints to cooling devices, and forward cooling state
> > > updates to the remote subsystem.
> > > 
> > > Co-developed-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> > > Signed-off-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> > > Signed-off-by: Casey Connolly <casey.connolly@xxxxxxxxxx>
> > > Signed-off-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxxxxxxxx>
> > 
> > Wrong SoB chain.
> 
> I think Gaurav wanted to reflect the changes did a back and forth between
> us, so I ended up in the delivery path somehow. I guess adding
> Co-developped-by should fix the SoB but won't reflect Gaurav and Casey did
> actually most of the work. So I'm fine if we remove my SoB to fix the chain

Anyway, Gaurav's SoB should be the last one (and it should be preceeded
by the CdB tag)

-- 
With best wishes
Dmitry