Re: [PATCH 1/4] dt-bindings: iio: adc: add ti,ads122c14

[David Lechner]

On 6/16/26 3:50 PM, Conor Dooley wrote:
> On Tue, Jun 16, 2026 at 02:54:55PM -0500, David Lechner wrote:
>> On 6/16/26 11:07 AM, Conor Dooley wrote:
>>> On Mon, Jun 15, 2026 at 04:59:59PM -0500, David Lechner (TI) wrote:
>>>> Add new bindings for ti,ads122c14 and similar devices.
>>>>
>>>> This is an ADC that is primarily intended for use with temperature
>>>> sensors. There are a few unusual properties because of this. In
>>>> particular, the reference voltage source and current output requirements
>>>> can be different for each measurement, so these are included in the
>>>> channel bindings.
>>>>
>>>> The REFP/REFN reference voltage is usually just connected to a resistor
>>>> that is being driven by the ADC's current outputs, so there is special
>>>> property for this case rather than requiring a regulator to be defined
>>>> to represent that.
>>>>
>>>> ti,vref-source is reused from ti,tlv320adcx140.yaml (otherwise might
>>>> have preferred an enum of strings).
>>>>
>>>> Signed-off-by: David Lechner (TI) <dlechner@xxxxxxxxxxxx>
>>>> ---
>>>>  .../devicetree/bindings/iio/adc/ti,ads112c14.yaml  | 224 +++++++++++++++++++++
>>>>  MAINTAINERS                                        |   7 +
>>>>  include/dt-bindings/iio/adc/ti,ads112c14.h         |  11 +
>>>>  3 files changed, 242 insertions(+)
>>>>
>>>> diff --git a/Documentation/devicetree/bindings/iio/adc/ti,ads112c14.yaml b/Documentation/devicetree/bindings/iio/adc/ti,ads112c14.yaml
>>>> new file mode 100644
>>>> index 000000000000..dc7f37cad772
>>>> --- /dev/null
>>>> +++ b/Documentation/devicetree/bindings/iio/adc/ti,ads112c14.yaml
>>>> @@ -0,0 +1,224 @@
>>>> +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
>>>> +%YAML 1.2
>>>> +---
>>>> +$id: http://devicetree.org/schemas/iio/adc/ti,ads112c14.yaml#
>>>> +$schema: http://devicetree.org/meta-schemas/core.yaml#
>>>> +
>>>> +title: Texas Instruments' ADS112C14 and similar ADC chips
>>>> +
>>>> +description: |
>>>> +  Supports the following Texas Instruments' ADC chips:
>>>> +  - ADS112C14 (16-bit)
>>>> +  - ADS122C14 (24-bit)
>>>> +
>>>> +  https://www.ti.com/lit/ds/symlink/ads122c14.pdf
>>>> +
>>>> +  These chips are primarily designed for use with temperature sensors such as
>>>> +  RTDs and thermocouples. The channel bindings reflect this in that each channel
>>>> +  represents the conditions required to make a measurement rather than strictly
>>>> +  just the physical input channels.
>>>> +
>>>> +maintainers:
>>>> +  - David Lechner <dlechner@xxxxxxxxxxxx>
>>>> +
>>>> +unevaluatedProperties: false
>>>
>>> Weird positioning of this.
>>
>> IIRC, Rob asked that I do it in this order on another binding a while
>> ago (the reasoning being that it was too far away from properties:
>> otherwise), so I've done it like this on a few bindings now. It doesn't
>> make much difference to me though.
> 
> Too far away because it refers to properties in the "main" node, but
> appears conventionally after a rake of properties belonging to the
> children?
> 
I found the original request:

https://lore.kernel.org/all/20241022204312.GA1524310-robh@xxxxxxxxxx/

"Easier to read the indented cases that way."

Reading it again, it sounds like the request was just for the indented
additionalProperties to be moved.