Re: [PATCH 1/4] dt-bindings: iio: adc: add ti,ads122c14

[Conor Dooley]

On Tue, Jun 16, 2026 at 04:04:43PM -0500, David Lechner wrote:
> On 6/16/26 3:50 PM, Conor Dooley wrote:
> > On Tue, Jun 16, 2026 at 02:54:55PM -0500, David Lechner wrote:
> >> On 6/16/26 11:07 AM, Conor Dooley wrote:
> >>> On Mon, Jun 15, 2026 at 04:59:59PM -0500, David Lechner (TI) wrote:
> >>>> Add new bindings for ti,ads122c14 and similar devices.
> >>>>
> >>>> This is an ADC that is primarily intended for use with temperature
> >>>> sensors. There are a few unusual properties because of this. In
> >>>> particular, the reference voltage source and current output requirements
> >>>> can be different for each measurement, so these are included in the
> >>>> channel bindings.
> >>>>
> >>>> The REFP/REFN reference voltage is usually just connected to a resistor
> >>>> that is being driven by the ADC's current outputs, so there is special
> >>>> property for this case rather than requiring a regulator to be defined
> >>>> to represent that.
> >>>>
> >>>> ti,vref-source is reused from ti,tlv320adcx140.yaml (otherwise might
> >>>> have preferred an enum of strings).
> >>>>
> >>>> Signed-off-by: David Lechner (TI) <dlechner@xxxxxxxxxxxx>
> >>>> ---
> >>>>  .../devicetree/bindings/iio/adc/ti,ads112c14.yaml  | 224 +++++++++++++++++++++
> >>>>  MAINTAINERS                                        |   7 +
> >>>>  include/dt-bindings/iio/adc/ti,ads112c14.h         |  11 +
> >>>>  3 files changed, 242 insertions(+)
> >>>>
> >>>> diff --git a/Documentation/devicetree/bindings/iio/adc/ti,ads112c14.yaml b/Documentation/devicetree/bindings/iio/adc/ti,ads112c14.yaml
> >>>> new file mode 100644
> >>>> index 000000000000..dc7f37cad772
> >>>> --- /dev/null
> >>>> +++ b/Documentation/devicetree/bindings/iio/adc/ti,ads112c14.yaml
> >>>> @@ -0,0 +1,224 @@
> >>>> +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
> >>>> +%YAML 1.2
> >>>> +---
> >>>> +$id: http://devicetree.org/schemas/iio/adc/ti,ads112c14.yaml#
> >>>> +$schema: http://devicetree.org/meta-schemas/core.yaml#
> >>>> +
> >>>> +title: Texas Instruments' ADS112C14 and similar ADC chips
> >>>> +
> >>>> +description: |
> >>>> +  Supports the following Texas Instruments' ADC chips:
> >>>> +  - ADS112C14 (16-bit)
> >>>> +  - ADS122C14 (24-bit)
> >>>> +
> >>>> +  https://www.ti.com/lit/ds/symlink/ads122c14.pdf
> >>>> +
> >>>> +  These chips are primarily designed for use with temperature sensors such as
> >>>> +  RTDs and thermocouples. The channel bindings reflect this in that each channel
> >>>> +  represents the conditions required to make a measurement rather than strictly
> >>>> +  just the physical input channels.
> >>>> +
> >>>> +maintainers:
> >>>> +  - David Lechner <dlechner@xxxxxxxxxxxx>
> >>>> +
> >>>> +unevaluatedProperties: false
> >>>
> >>> Weird positioning of this.
> >>
> >> IIRC, Rob asked that I do it in this order on another binding a while
> >> ago (the reasoning being that it was too far away from properties:
> >> otherwise), so I've done it like this on a few bindings now. It doesn't
> >> make much difference to me though.
> > 
> > Too far away because it refers to properties in the "main" node, but
> > appears conventionally after a rake of properties belonging to the
> > children?
> > 
> I found the original request:
> 
> https://lore.kernel.org/all/20241022204312.GA1524310-robh@xxxxxxxxxx/
> 
> "Easier to read the indented cases that way."
> 
> Reading it again, it sounds like the request was just for the indented
> additionalProperties to be moved.

I think so, yeah. It's definitely common to see
    patternProperties:
      "^dma-channel@[0-9a-f]+$":
        type: object
	unevaluatedProperties: false
        description:
          DMA channel properties based on HDL compile-time configuration.

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