Re: [PATCH v4 01/10] dt-bindings: firmware: qcom: tmd: add TMD device type constants

[Krzysztof Kozlowski]

On Fri, Jul 03, 2026 at 10:33:04AM +0530, Gaurav Kohli wrote:
> Add Device Tree binding constants for Qualcomm Thermal Mitigation
> Device (TMD) types used by remoteproc-backed thermal cooling devices.
> 
> Qualcomm remote processors expose thermal mitigation endpoints
> through QMI. These endpoints can be registered with the thermal
> framework via the `#cooling-cells` property on the remoteproc node.
> 
> The QMI TMD protocol identifies devices using string names (for example,
> "pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with
> `#cooling-cells = <3>` requires numeric device id in the form:
> 
>   <&phandle device_id min_state max_state>
> 
> Define common TMD device index constants shared across currently
> supported platforms. If a future target requires a different mapping,
> additional target-specific constants can be introduced while preserving
> existing DT ABI.
> 
> Signed-off-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
> ---
>  MAINTAINERS                                 |  1 +
>  include/dt-bindings/firmware/qcom,qmi-tmd.h | 20 ++++++++++++++++++++

As explained many times: Header file is not a separate commit. You need
binding using this.

>  2 files changed, 21 insertions(+)
> 
> diff --git a/MAINTAINERS b/MAINTAINERS
> index 57656ec0e9d5..ffd85fd1dd80 100644
> --- a/MAINTAINERS
> +++ b/MAINTAINERS
> @@ -3410,6 +3410,7 @@ F:	drivers/firmware/qcom/
>  F:	drivers/soc/qcom/
>  F:	drivers/watchdog/gunyah_wdt.c
>  F:	include/dt-bindings/arm/qcom,ids.h
> +F:	include/dt-bindings/firmware/qcom,qmi-tmd.h
>  F:	include/dt-bindings/firmware/qcom,scm.h
>  F:	include/dt-bindings/soc/qcom*
>  F:	include/linux/firmware/qcom
> diff --git a/include/dt-bindings/firmware/qcom,qmi-tmd.h b/include/dt-bindings/firmware/qcom,qmi-tmd.h
> new file mode 100644
> index 000000000000..73efecef0f3c
> --- /dev/null
> +++ b/include/dt-bindings/firmware/qcom,qmi-tmd.h
> @@ -0,0 +1,20 @@
> +/* SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause */
> +/*
> + * Qualcomm QMI TMD (Thermal Mitigation Device) cooling device indices
> + *
> + * These indices are used in device tree cooling-maps to reference
> + * specific TMD devices provided by remote processors via QMI.
> + *
> + * Copyright (c) Qualcomm Technologies, Inc. and/or its subsidiaries.
> + */
> +#ifndef _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H
> +#define _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H
> +
> +/* CDSP thermal mitigation device id */
> +#define QCOM_CDSP_TMD_CDSP_SW	0

QCOM_TMD_CDSP

> +
> +/* Modem thermal mitigation device id */
> +#define QCOM_MODEM_TMD_PA	0

QCOM_TMD_MODEM_PA

> +#define QCOM_MODEM_TMD_MODEM	1

QCOM_TMD_MODEM

Best regards,
Krzysztof