[PATCH v4 01/10] dt-bindings: firmware: qcom: tmd: add TMD device type constants

[Gaurav Kohli]

Add Device Tree binding constants for Qualcomm Thermal Mitigation
Device (TMD) types used by remoteproc-backed thermal cooling devices.

Qualcomm remote processors expose thermal mitigation endpoints
through QMI. These endpoints can be registered with the thermal
framework via the `#cooling-cells` property on the remoteproc node.

The QMI TMD protocol identifies devices using string names (for example,
"pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with
`#cooling-cells = <3>` requires numeric device id in the form:

  <&phandle device_id min_state max_state>

Define common TMD device index constants shared across currently
supported platforms. If a future target requires a different mapping,
additional target-specific constants can be introduced while preserving
existing DT ABI.

Signed-off-by: Gaurav Kohli <gaurav.kohli@xxxxxxxxxxxxxxxx>
---
 MAINTAINERS                                 |  1 +
 include/dt-bindings/firmware/qcom,qmi-tmd.h | 20 ++++++++++++++++++++
 2 files changed, 21 insertions(+)

diff --git a/MAINTAINERS b/MAINTAINERS
index 57656ec0e9d5..ffd85fd1dd80 100644
--- a/MAINTAINERS
+++ b/MAINTAINERS
@@ -3410,6 +3410,7 @@ F:	drivers/firmware/qcom/
 F:	drivers/soc/qcom/
 F:	drivers/watchdog/gunyah_wdt.c
 F:	include/dt-bindings/arm/qcom,ids.h
+F:	include/dt-bindings/firmware/qcom,qmi-tmd.h
 F:	include/dt-bindings/firmware/qcom,scm.h
 F:	include/dt-bindings/soc/qcom*
 F:	include/linux/firmware/qcom
diff --git a/include/dt-bindings/firmware/qcom,qmi-tmd.h b/include/dt-bindings/firmware/qcom,qmi-tmd.h
new file mode 100644
index 000000000000..73efecef0f3c
--- /dev/null
+++ b/include/dt-bindings/firmware/qcom,qmi-tmd.h
@@ -0,0 +1,20 @@
+/* SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause */
+/*
+ * Qualcomm QMI TMD (Thermal Mitigation Device) cooling device indices
+ *
+ * These indices are used in device tree cooling-maps to reference
+ * specific TMD devices provided by remote processors via QMI.
+ *
+ * Copyright (c) Qualcomm Technologies, Inc. and/or its subsidiaries.
+ */
+#ifndef _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H
+#define _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H
+
+/* CDSP thermal mitigation device id */
+#define QCOM_CDSP_TMD_CDSP_SW	0
+
+/* Modem thermal mitigation device id */
+#define QCOM_MODEM_TMD_PA	0
+#define QCOM_MODEM_TMD_MODEM	1
+
+#endif /* _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H */

-- 
2.34.1