[PATCH v2 1/2] dt-bindings: iio: temperature: Add support for tmp006

[Anup Sharma]

Add devicetree binding document for TMP006, IR thermopile sensor.

Signed-off-by: Anup Sharma <anupnewsmail@xxxxxxxxx>
---
Changes:
V1 -> V2: Removed redundant dt-binding from subject.
          Added supply information.
          Adhere to the generic node name.
	  Adding missing semicolon to fix syntax error detected
	  using dt_binding_check
---
 .../bindings/iio/temperature/ti,tmp006.yaml   | 42 +++++++++++++++++++
 1 file changed, 42 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml

diff --git a/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
new file mode 100644
index 000000000000..d43002b9bfdc
--- /dev/null
+++ b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
@@ -0,0 +1,42 @@
+# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/iio/temperature/ti,tmp006.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: TI TMP006 IR thermopile sensor
+
+maintainers:
+  - Peter Meerwald <pmeerw@xxxxxxxxxx>
+
+description: |
+  TI TMP006 - Infrared Thermopile Sensor in Chip-Scale Package.
+  https://cdn.sparkfun.com/datasheets/Sensors/Temp/tmp006.pdf
+
+properties:
+  compatible:
+    const: ti,tmp006
+
+  reg:
+    maxItems: 1
+
+  vdd-supply:
+    description: provide VDD power to the sensor.
+
+required:
+  - compatible
+  - reg
+
+additionalProperties: false
+
+examples:
+  - |
+    i2c {
+        #address-cells = <1>;
+        #size-cells = <0>;
+        temperature-sensor@40 {
+            compatible = "ti,tmp006";
+            reg = <0x40>;
+            vdd-supply = <&ldo4_reg>;
+        };
+    };
-- 
2.34.1